In the SUNSAY GENERIC, it is involved in the development of ROBOT for the semiconductor manufacture besides manufacturing and development the power supply for plasma (high-frequency power source and matching unit) and such as various measuring instrument machines.
RF Generator and RF Matching Unit are innovated a high-speed 32Bit RISC CPU. High-speed PLASMA environment stable with high precision by the original digital control algorithm was realized.
High-speed operation is about 1.5 times to 20 times compare with old goods.
And, the operation stability level is about 1.5 times to 10 times.
To address the changes in high-load PLASMA environment and the condition, original high-pressure, large current, and high-frequency NET WORK were developed. And, high-ruggedness that keep pace a rapid change of impedance become reality.
Conservation of the PLASMA condition, exploitation and assessment of a recipe easily became possible.
High-speed RISC CPU using, and the RF signal is processed digitally in high-speed and high accuracy by the digital technique that is an original patent. Moreover, the change in a short time such as anomalous discharge etc. is not missed by catching the change of impedance in Process of the RF real time analysis, the investigation, and the RF interlock, etc. in high accuracy.
By accept to Windows, sharing, the analysis, and the preservation of DATA can be easily done.
It is possible to conservation of the PLASMA easily.
High-speed 32Bit RISC CPU using, and the RF signal is processed digitally in high-speed and high accuracy by the digital technique that is an original patent. Moreover, the change in a short time in the anomalous discharge etc. is not missed by catching the change of impedance in Process of the RF real time analysis, the investigation, and the RF interlock, etc. in high accuracy.
When the PLASMA trouble is detected, automatically migrate over to an abnormal processing process. And a steady process environment is maintained in retry process.
A normal value, the warning value, and the unexpected value are managed by the trouble prospect diagnostic function and the stability of operation is aimed at.
A mighty vacuum seal technology and a Nano dry seal were developed by an original development. The corrosion problem of the magnetic substance that had become a problem solved by a nonmetal Nano dry seal.
The corrosion by the chlorine reaction of the magnet material (iron etc.) by moisture, chlorine system gas, etc. was suppressed, and it became possible to use magnetic fluid sealing by wet environment or corrosive gas environment.
Moreover, if magnetic fluid sealing is used in a high vacuum environment, grease will evaporate. Therefore, it solved also about the point which was not able to be used in a high vacuum by oil less and Nano dry seal that is the super-vacuum sealing technology of original development.
Originality is evaluated highly in the plasma technic development which is bearing a semiconductor, a liquid crystal, a solar cell, organic EL, and the main technology of development of a thin film. The patent was able to be acquired by the technology's having been evaluated. The problem that was not able to be solved with the prior art has improved rapidly by demonstrating originality.
We are advancing development to devote energies to the development of the next generation technology, and to make it to the embodiment promptly all day and all night.
We aim at the improvement of the global environment and the achievement of the low carbon society, and are trying to improve the social climate to the development of a new technology.
Consumed power cut down about 30% to 85% as compared to past products.
Environment load cut down about 30% to 70% as compared to past products. Moreover, longevity became about 1.5 times to 3 times long-lived.
Because our company do the exploitation, designing, software development, test production, test, assessment, correspondence by a short-term delivery date became possible.
High-speed 32Bit RISC CPU digital temperature adjustment technology of original development was developed.
About 20% to 90% of stability improvement by original digital temperature adjustment technology (fully-closed program).
We developed an inverter circulation pump and a multistage scroll, and an original tank built-in energy saving.
Consumed power cut down about 15% to 80% as compared to past products by an original digital pressure control operation, and digital flow control operation. And, Maintenance cost cut down about 20% to 75% by long lived.
Applied technology of original electron, CPU exploitation technology, Software development, control technique
Analog, digital control technology, Digital communication technology, High-frequency exploitation technology
Exploitation technology of AC, DC, and high voltage power supply, Servo technology
PLASMA technology, Vacuum technology
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In manufacturing the semiconductor, we are developing the manufacturing device that assume the etching process.
Moreover, the maintenance work is received from the support of those semiconductor-fabrication equipment.
VER UP remodeling for microfabrication of semiconductor-fabrication equipment 300mmm 200mm 150mm
NEW Process conversion remodeling of semiconductor-fabrication equipment
VER UP remodeling for microfabrication of liquid crystal and photovoltaic production 2G～8G
NEW Process conversion remodeling of liquid crystal and photovoltaic production 2G～8G
PLASMA module VERUP remodeling for microfabrication of semiconductor-fabrication equipment
The maximum speed of a super-high-speed RF MATHING technology achieved 10mSEC.
NEW Process conversion remodeling of semiconductor-fabrication equipment
VER UP remodeling for microfabrication of liquid crystal and photovoltaic production 2G～8G
NEW Process conversion remodeling of liquid crystal and photovoltaic production 2G
VERUP remodeling for new materials process of organic EL and microfabrication 1G～
Conversion remodeling in PLASMA process for thin film processing of industrial use
Transportation ROBOT conversion remodeling UP remodeling for high vacuum processing of semiconductor-fabrication equipment
Transportation ROBOTVERUP remodeling for microfabrication of semiconductor-fabrication equipment
PLASMA unit VERUP remodeling for new material Process processing of semiconductor-fabrication equipment
PLASMA unit VERUP remodeling for the deep trench processing of semiconductor-fabrication equipment
VERUP remodeling for microfabrication of liquid crystal manufacturing 2G～8G
New material Process PLASMA unit VERUP remodeling of manufacturing device for secondary battery
Minute Process PLASMA unit VERUP remodeling of mask manufacturing device
NEW Process conversion remodeling of photovoltaic production 2G～8G
Head Office/Factory
2-14-3 Shingai-cho Fukuyana-city Hiroshima 721-0955 Japan
Tel:+81-84-981-2770
Fax:+81-84-981-2780
R&D center
2-15-31 Shingai-cho Fukuyana-city Hiroshima 721-0955 Japan
Tel:+81-84-981-2770
Fax:+81-84-981-2780
Technology center
2-14-3 Shingai-cho Fukuyana-city Hiroshima 721-0955 Japan
Tel:+81-84-981-2770
Fax:+81-84-981-2780
Design center
1-13-12 Tuthido Onomiti-city Hiroshima 722-0035 Japan
Tel:+81-84-981-2770
Fax:+81-84-981-2780
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